Samsung's Exynos processors have been criticized for often running too hot, having unstable performance, and having power-hungry processors. However, this year's Exynos 2400 has been greatly improved. However, there are many things that Samsung can improve to make Exynos even better.

High-end Exynos processors of 2026 may run cooler

Samsung is said to be trying to improve heat dissipation for Exynos processors. According to a new report from THEELEC, its Advanced Package (AVP) group is developing a new IC packaging technology called Fan-Out Wafer Level Packaging Heat Patch Block (FOWLP-HPB).

This technology has appeared on servers and personal computers. Samsung is just trying to apply FOWLP-HPB to phone processors to increase the processing capabilities of Exynos. The new technology is expected to be completed by the end of this year and ready for mass production.

If Samsung decides to use FOWLP-HPB, you can experience this new technology in 2026 because the Exynos 2500 (tentative name) for the Galaxy S25 will be mass-produced in the fourth quarter of this year.

Some phone models use vapor chambers to help the device dissipate heat better. With FOWLP-HPB, heat dissipation will be further improved. In addition, Samsung is also trying many new materials to package the processor. The company is also working on a new, even better technology called FOWLP-System-in-Package (FOWLP-SiP).

Hopefully, Samsung can completely solve Exynos's heating problems to be on par with its competitors, including Apple, MediaTek, and Qualcomm.